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● High speed up to 8000 MT/s
● Heat sink design enhances memory dissipation
● intel XMP 3.0 and AMD EXPO Support
● Compatibility with intel and AMD platforms
● Programmable RGB Lighting
● Carefully selected high-quality chips from
original manufacturers
● Meeting JEDEC standards
● Built-in Power Management IC
● Support On-die ECC error correction functionality
● High-quality PCB provides improved signal
transfer and system stability
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
|---|---|
| Backlight | No |
| Buffered memory type | Unregistered (unbuffered) |
| CAS latency | 30 |
| Component for | PC |
| Cooling type | Heatsink |
| ECC | Yes |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory | 32 GB |
| Memory Type | DDR5 |
| Memory data transfer rate | 6000 MT/s |
| Memory form factor | 288-pin DIMM |
| Memory layout (modules x size) | 2 x 16 GB |
| Memory voltage | 1.35/1.4 V |
| On-Die ECC | Yes |
| Colour | Black |
| Operating temperature (T-T) | 0 — 85 °C |
| Depth | 133.35 mm |
| Height | 7.7 mm |
| Weight | 110 g |
| Width | 37 mm |
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